| PART |
Description |
Maker |
| 370LS016XM10 370LS016XM12 370LS016XM13 370HW016XM1 |
Composite Cable-Sealing Environmental Backshell
|
Glenair, Inc.
|
| 447AS329XM08 447FS329XM08 447LS329XM08 447SS329XM0 |
Composite EMI/RFI Environmental Band-in-a-Can Backshell with Strain-Relief Clamp
|
Glenair, Inc.
|
| 447LW330XM08 447LW330XM10 447LW330XM12 447LW330XM1 |
Composite Non-Environmental EMI/RFI Band-in-a-Can Backshell with Qwik-Clamp Strain-Relief
|
Glenair, Inc.
|
| XN04212 XN4212 |
Silicon NPN epitaxial planer transistor
Composite Device - Composite Transistors
|
Panasonic Semiconductor
|
| XN04215 XN4215 |
Composite Device - Composite Transistors
Silicon NPN epitaxial planer transistor
|
PANASONIC[Panasonic Semiconductor]
|
| XN01119 XN1119 |
Composite Device - Composite Transistors
From old datasheet system
Silicon PNP epitaxial planer transistor
|
Panasonic Semiconductor
|
| XN08081 |
Composite Device - Composite Transistors
From old datasheet system
|
Panasonic
|
| XN04115 |
Composite Device - Composite Transistors
From old datasheet system
|
panasonic
|
| XN0111H |
Composite Device - Composite Transistors
From old datasheet system
|
panasonic
|
| XN01117 |
Composite Device - Composite Transistors 复合设备-复合晶体
|
Ricoh Co., Ltd.
|
| XN6116 |
Composite Device - Composite Transistors 复合设备-复合晶体
|
Panasonic, Corp.
|
